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High Purity Aluminum Nitride AlN Ceramic Microsphere, 99.5%

Description of AlN Ceramic Microsphere Aluminum Nitride AlN :

High thermal conductivity: The thermal conductivity of aluminum nitride ceramic microspheres is very high, and they can effectively transfer heat to dissipate heat more effectively in electronic devices.

High mechanical strength: aluminum nitride ceramic microspheres have high mechanical strength and can withstand high loads and shocks, making them useful as high-performance bearings, gears, and other mechanical components in the mechanical field.

High insulation performance: aluminum nitride ceramic microspheres have high insulation performance, effectively preventing current leakage and interference so that safe and reliable operation can be ensured in electronic equipment.

Chemical stability: Aluminum nitride ceramic microspheres have excellent chemical stability and can maintain stable performance under high temperatures and corrosive environments. 

AlN Ceramic Microspheres Product Performance AlN Aluminum Nitride AlN AlN exhibits excellent insulation properties. AlN is also very thermally conductive. AlN powder could be added to resin.
AlN Ceramic Microsphere featuring Aluminum Nitride AlN
You can find spheres quite close to one another.
These fees are often very costly.
Good flow
Sharp particle size distribution
Very high thermal conductivity
We recommend insulation of outstanding quality with excellent electrical characteristics.

Specification:

Products Tr-01 Tr-10 Tr-30 Tr-50 Tr-80 Tr-120
It is the average particle diameter (um). 1.0-1.2 5-10 20-40 40-60 70-90 110-130
Particle Form Nearest Spherical They are very near each other. Spherical Spherical Spherical Spherical
True Density, g/cm3 3.26 3.26 >3.30 >3.30 >3.30 >3.30
Thermal conductivity (W/m*K). >170 >170 >170 >170 >170 >170
Bulk Density (g/cm3) 0.3-0.5 1.3-1.5 1.4-1.6 1.6-1.8 1.7-1.9 1.7-1.9
Tap Density, g/cm3 0.7-0.9 1.6-1.8 1.8-2.0 1.8-2.0 1.9-2.1 1.9-2.1

AlN Ceramic Microsphere. Aluminium Nitride
AlN N Fe Mn O C Ca Si Ni
>99.5% >=32% 0.04 0.0005 <=0.42 0.02 <=0.009 <=0.045 0.0002


Application of AlN Ceramic Microsphere Aluminum Nitride AlN :

Electronic field

In electronics, aluminum nitride ceramic microspheres are widely used in electronic packaging materials, circuit board components, and crystal oscillator bases.

Electronic packaging materials: Aluminum nitride ceramic microspheres have excellent insulation properties, which can effectively transfer heat and prevent current leakage, and are ideal electronic packaging materials. By mixing aluminum nitride ceramic microspheres with materials such as polymers or resins, electronic packaging materials with excellent thermal conductivity and mechanical strength can be prepared.

Circuit board components: Aluminum nitride ceramic microspheres have high corrosion resistance and can be used to produce circuit board components. By mixing aluminum nitride ceramic microspheres with glass fiber and other materials, circuit board components with high strength and excellent electrical insulation properties can be prepared.

Crystal oscillator base: Aluminum nitride ceramic microspheres have excellent thermal stability and mechanical strength and can be used to produce crystal oscillator bases. By combining aluminum nitride ceramic microspheres with quartz crystals, a crystal oscillator base with high precision and stability can be obtained.

The field of machinery

In the machinery field, aluminum nitride ceramic microspheres are widely used in high-performance bearings, gears, and other mechanical components.

High-performance bearings: Aluminum nitride ceramic microspheres have high mechanical strength, high wear resistance, and excellent corrosion resistance and are suitable for the production of high-performance bearings. High-performance bearings with high speed, low friction coefficient, and long service life can be obtained by combining aluminum nitride ceramic microspheres with metal bearing sleeves and other materials.

Gears: Aluminum nitride ceramic microspheres with high mechanical strength and corrosion resistance are suitable for production gears. Using aluminum nitride ceramic microspheres in combination with materials such as metal gear sleeves, backpacks with high transmission efficiency, low noise, and long service life can be obtained.

Wear-resistant parts: Aluminum nitride ceramic microspheres have high hardness and excellent corrosion resistance, suitable for producing wear-resistant parts. Wear-resistant parts with excellent wear resistance and long service life can be obtained by combining aluminum nitride ceramic microspheres with metal substrates.

Aerospace

In aerospace, aluminum nitride ceramic microspheres are widely used in high-temperature structural parts and spacecraft heat sinks.

High-temperature structural parts: aluminum nitride ceramic microspheres have high-temperature performance and excellent mechanical strength, suitable for producing high-temperature structural components. By combining aluminum nitride ceramic microspheres with metal matrix and other materials, structural parts with excellent high-temperature performance and high mechanical strength can be obtained.

Spacecraft heat sink: aluminum nitride ceramic microspheres have high thermal conductivity and excellent mechanical strength and are suitable for producing spacecraft heat sinks. By combining aluminum nitride ceramic microspheres with a metal heat dissipation matrix, spacecraft heat sinks with excellent heat dissipation performance and high mechanical strength can be obtained.

In addition, aluminum nitride ceramic microspheres can also be used in optical fields, such as the preparation of optical devices and optical Windows. Because of its high light transmittance and excellent chemical stability, it can be used to prepare high-precision and high-stability optical devices and optical Windows.


Production Method of AlN Ceramic Microsphere Aluminum Nitride AlN :

Raw material preparation

The production of aluminum nitride ceramic microspheres requires the preparation of the following raw materials:

Aluminum oxide powder: as an essential raw material, it requires high purity, fine particle size, and good activity.

Aluminum nitride powder: as a nitriding source, it requires high purity, fine particle size, and good activity.

Binder: Usually used polymer, resin, etc., used to improve the fluidity of the slurry.

Solvent: Used to adjust the viscosity of the slurry, such as ethanol, acetone, etc.

Catalyst: Used to promote nitriding reaction, commonly used ammonium chloride, sodium nitrate, etc.

Prepare the slurry

The aluminum oxide powder, nitride powder, binder, solvent, and catalyst are mixed according to a particular proportion and are ground or stirred in a ball mill or blender to prepare a uniform and stable slurry. In this process, it is necessary to control the grinding time, starting speed, and viscosity parameters to ensure the performance of the slurry.

Preparation of microsphere morphology

The microsphere morphology was prepared by spray drying, ball milling, or 3D printing. Among them, the spray drying method is to spray the slurry into a mist through the nozzle and form a microsphere shape during the drying process. The ball mill method is to put the slurry into the ball mill for a specific time so that the slurry gradually forms a microsphere shape. The 3D printing method uses 3D printing technology to print the formation of the microsphere directly.

Nitriding treatment

The prepared microspheres were nitrided to obtain aluminum nitride ceramic microspheres. Nitriding is usually treated by high-temperature heat treatment or chemical vapor deposition. Among them, the high-temperature heat treatment puts the microsphere morphology into the nitriding furnace, and heat treatment is carried out by injecting nitrogen at a high temperature. Chemical vapor deposition (CVD) is a process in which the microsphere morphology is put into a deposition furnace, and nitrogen-containing gas is introduced for the chemical reaction to form an aluminum nitride layer on the microsphere's surface.

Post-processing

After nitriding, the resulting aluminum nitride ceramic microspheres must be post-treated to obtain the final product. Post-treatment includes cleaning, drying, surface treatment, etc. Among them, cleaning is to remove impurities and residues attached to the microsphere's surface; Drying is to remove the water and solvent inside the microsphere; surface treatment is to improve the surface smoothness and insulation properties of the microspheres.



AlN Ceramic Microsphere Store Conditions:

Aluminium-nitride ceramic microspheres may become dampened from condensation. Vacuum bags can be used to dry the microspheres made of aluminum-nitrideclay clay. AlN/Aluminum ceramic Clay must be kept out of direct sunlight. It is important to protect the AlN/Ceramic microsphere from direct sunlight.

AlN Ceramic Microspheres also know as AlN Ceramic Microspheres can be packaged and shipped
There are many options, depending on whether to choose AlN ceramic microscopic microspheres (AlNmicrospheres), of aluminium Nitride.
AlN ceramic nanospheres are made with aluminum nitride. 25kg/barrel. You can find out more information here.
You can order all types of aluminum nitride or ceramic microsphere as long as you receive receipts.

Synthetic Chemical Nanotechnology Co. Ltd. enjoys a worldwide reputation as a trustworthy manufacturer and supplier of chemical product. It was formed in 2012. Graphite. sulfide. 3D printing powders.
These Microsphere have high-quality . (sales5@nanotrun.com)


Alnic Nickel Mikrosphere properties

Sometimes referred to as Aluminium nitride
24304-00-5
Combination Formula AlN
Molecular mass 40.9882
Appearance From white powder, to pale powder
Melting Point 2200 degC
Boiling Point 2517 degC (dec.)
Density 2.9% upto 3.3g/cm
N/A
Electrical Resistance 10-12 O-m 10x
Poissons' Rate 0.21 to $0.31
780 J/kg-K
Hydro Conductivity 80-200 Watts/m
Thermal Expansion 4.2 to 5.4 um/m-1
Young’s Modular 330 GPa
The exact 40.9846
Monoisotopic 40.9846

Safety & Health Information

Comments Danger
Hazard Statements H314-H335
Hazard Codes Xi
Risk Codes 36/37/38
Privacy Statement 26-37/39
RTECS # N/A
Transport Information N/A
Germany 3

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